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Thermal Shock Resistance of a Kyanite-Based (Aluminosilicate) Ceramic

Author(s): Rahbar, N; Aduda, BO; Zimba, J; Obwoya, SK; Nyongesa, FW; et al

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dc.contributor.authorRahbar, N-
dc.contributor.authorAduda, BO-
dc.contributor.authorZimba, J-
dc.contributor.authorObwoya, SK-
dc.contributor.authorNyongesa, FW-
dc.contributor.authorYakub, I-
dc.contributor.authorSoboyejo, WO-
dc.date.accessioned2021-10-08T20:18:55Z-
dc.date.available2021-10-08T20:18:55Z-
dc.date.issued2011en_US
dc.identifier.citationRahbar, N., Bernard O. Aduda, J. Zimba, S. K. Obwoya, F. W. Nyongesa, I. Yakub, and W. O. Soboyejo. "Thermal shock resistance of a kyanite-based (aluminosilicate) ceramic." Experimental Mechanics 51, no. 2 (2011): 133-141. doi: 10.1007/s11340-010-9345-3en_US
dc.identifier.issn0014-4851-
dc.identifier.urihttps://www.researchgate.net/publication/225716234_Thermal_Shock_Resistance_of_a_Kyanite-Based_Aluminosilicate_Ceramic-
dc.identifier.urihttp://arks.princeton.edu/ark:/88435/pr1jc5g-
dc.description.abstractThis paper presents the results of a combined experimental and theoretical study of microstructure and thermal shock resistance of an aluminosilicate ceramic. Shock-induced crack growth is studied in sintered structures produced from powders with different particle size ranges. The underlying crack/microstructure interactions and toughening mechanisms are elucidated via scanning electron microscopy (SEM). The resulting crack-tip shielding levels (due to viscoelastic crack bridging) are estimated using fracture mechanics concepts. The implications of the work are discussed for the design of high refractory ceramics against thermal shock.en_US
dc.format.extent133 - 141en_US
dc.language.isoen_USen_US
dc.relation.ispartofExperimental Mechanicsen_US
dc.rightsAuthor's manuscripten_US
dc.titleThermal Shock Resistance of a Kyanite-Based (Aluminosilicate) Ceramicen_US
dc.typeJournal Articleen_US
dc.identifier.doi10.1007/s11340-010-9345-3-
dc.identifier.eissn1741-2765-
pu.type.symplectichttp://www.symplectic.co.uk/publications/atom-terms/1.0/conference-proceedingen_US

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